- Tensor G5 development at TSMC for Pixel 10 progressing, based on 3-nanometer manufacturing process and Integrated Fan-Out technology
- Google’s transition from Samsung to TSMC for Tensor G5 confirmed in July 2023, with ongoing work for Pixel 10
- “Redondo” chip project for 2024 missed deadlines, focus shifted to 2025 “Laguna” chip with beach-themed codenames
- Early chip revision for Tensor G5 includes 16GB RAM from Samsung, supporting generative AI capabilities
- InFO_PoP technology used for chip packaging, offering thinner profile and improved electrical and thermal performance
https://9to5google.com/2024/05/25/pixel-10-tensor-g5-tsmc/
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